Technical data for design verification |
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Rated operational current for specified heat dissipation |
In |
A |
0
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Heat dissipation per pole, current-dependent |
Pvid |
W |
0
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Equipment heat dissipation, current-dependent |
Pvid |
W |
0
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Static heat dissipation, non-current-dependent |
Pvs |
W |
0
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Heat dissipation capacity |
Pdiss |
W |
0
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Operating ambient temperature min. |
|
°C |
-25
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Operating ambient temperature max. |
|
°C |
60
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IEC/EN 61439 design verification |
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10.2 Strength of materials and parts |
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10.2.2 Corrosion resistance |
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Meets the product standard's requirements.
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10.2.3.1 Verification of thermal stability of enclosures |
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Meets the product standard's requirements.
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10.2.3.2 Verification of resistance of insulating materials to normal heat |
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Meets the product standard's requirements.
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10.2.3.3 Verification of resistance of insulating materials to abnormal heat and fire due to internal electric effects |
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Meets the product standard's requirements.
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10.2.4 Resistance to ultra-violet (UV) radiation |
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Meets the product standard's requirements.
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10.2.5 Lifting |
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Does not apply, since the entire switchgear needs to be evaluated.
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10.2.6 Mechanical impact |
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Does not apply, since the entire switchgear needs to be evaluated.
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10.2.7 Inscriptions |
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Meets the product standard's requirements.
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10.3 Degree of protection of ASSEMBLIES |
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Does not apply, since the entire switchgear needs to be evaluated.
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10.4 Clearances and creepage distances |
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Meets the product standard's requirements.
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10.5 Protection against electric shock |
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Does not apply, since the entire switchgear needs to be evaluated.
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10.6 Incorporation of switching devices and components |
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Does not apply, since the entire switchgear needs to be evaluated.
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10.7 Internal electrical circuits and connections |
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Is the panel builder's responsibility.
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10.8 Connections for external conductors |
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Is the panel builder's responsibility.
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10.9 Insulation properties |
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10.9.2 Power-frequency electric strength |
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Is the panel builder's responsibility.
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10.9.3 Impulse withstand voltage |
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Is the panel builder's responsibility.
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10.9.4 Testing of enclosures made of insulating material |
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Is the panel builder's responsibility.
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10.10 Temperature rise |
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The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.
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10.11 Short-circuit rating |
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Is the panel builder's responsibility. The specifications for the switchgear must be observed.
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10.12 Electromagnetic compatibility |
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Is the panel builder's responsibility. The specifications for the switchgear must be observed.
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10.13 Mechanical function |
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The device meets the requirements, provided the information in the instruction leaflet (IL) is observed.
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